Power Integrity(PI) Analysis and Simulation

Power integrity (PI) analysis is an essential part of modern electronic design. The ever-increasing numbers of voltages used by ICs, in addition to dramatic increases in power consumption, make the challenges of improving power integrity an exceedingly difficult task. Compounding these challenges are reduced layer counts and finer pitch BGA footprints that perforate copper planes, making it difficult to supply DC voltage and current.

With inadequate power delivery, designs can exhibit seemingly intermittent signal integrity issues, which cause the logic on the board to fail. If power delivery is extremely poor, there can be complete part failure due to inadequate voltage and/or current resulting in a non-functional design.

BestPCB team have extensive experiences in power delivery network design, modeling, analysis and optimization extends to IC, package, and PCB designs in various applications – computing, communications, automobile, medical care, aviation, etc.

Our PI analysis capabilities will ultimately help you reduce prototype spins and get to market faster, while creating more reliable products. BestPCB team can:

DC Power Analysis

BestPCB team perform pre-layout and post-layout analysis to predict IR drop across PCB board and components to determine optimal PCB plane cu weight (1/2, 1, or 2 oz?) , PCB stackup , power plane shape and via size, number of vias and via location etc.

AC Power Analysis

BestPCB team perform pre-layout and post-layout analysis to predict IR drop across PCB board and components to determine optimal PCB plane cu weight (1/2, 1, or 2 oz?) , PCB stackup , power plane shape and via size, number of vias and via location etc.BestPCB team perform pre-layout and post-layout AC power integrity analysis in both frequency domain and time domain to analyze power delivery network (PDN)’s behavior and perform design trade off and optimization to meet system design target.

Typical Power Integrity Analysis Tasks